Produkt beskrivelse
A thermal conductive silicone Pad material without reinforcement is high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or product outer covering. Thermal Conductive Silicone Pad has soft and flexible, excellent thermal conductivity natural sticky which also aids in the assembly process.
Ansøgning
Termisk ledende silikonepudemateriale uden forstærkning kan påføres kommunikationsudstyr, LED-belysning, switch strømforsyning, baggrundsbelysningsmodulet, medicinsk udstyr, mobilt udstyr, videoudstyr, netværksudstyr, husholdningsudstyr, pc-server/arbejdsstationer osv.
Anvendelsestilstande
Påfyldning mellem PCB og køleplade
Påfyldning mellem IC og køleplade eller produktets yderbeklædning
Påfyldning mellem IC og andre køleenheder
Fysiske egenskaber
Disse værdier er målte værdier og ikke garanterede værdier.
Tilgængelige størrelser
Bredde: Maksimal bredde 41,3 tommer (1030 mm). (Kan tilpasses)
Længde: 25m/50m (Kan tilpasses).
Tilpassede størrelser: Hvis du har brug for tilpassede størrelser eller udstansede-dele, er du velkommen til at kontakte NKS salgsrepræsentant.
Relaterede produkter
Xiamen Naikos Industrial Co., Ltd was set up in the beautiful city-Xiamen. It has several production lines and cutting, die-cutting machines. We are able to provide the services of RD, production, and procession for customers. we have developed different thermally conductive materials according to different applications and requirements. They are NKS series thermally conductive adhesive tapes, TC Soft Thermal Conductive Silicone Pad w/o Reinforcement, etc. They are applied as excellent thermal conductive fillers and are mainly used in industries like LED, Power Supply, Telecommunication, Computer and peripherals, PDP, LED TV, Automotive, Home Appliance, etc. The products were approved by SGS, REACH, and UL.
